Hangzhou  VOIR ® SCU iterative vacuum dust-free connection scheme. The biggest feature of the new solution is to meet the highest level requirements of semiconductor lithography lighting systems:
1. Self support;
2. Reduce the complexity of components and installation during long journeys;
3. The new process ensures lower gas release during the manufacturing and packaging processes: 10¹¹Pa · L · s ⁻¹· cm ⁻ ².

        VOIR ® Semiconductor Materials Engineer: "After this iteration upgrade, we meet the highest level requirements of the current lithography illumination system, effectively promoting the development of the domestic semiconductor industry. We are confident in taking advantage of the situation to promote technological upgrades
        We will showcase our self-supporting vacuum dust-free technology at the SEMICON Taiwan Semiconductor Exhibition in September 2024. Welcome to consult and exchange ideas.

VOIR ® SCU in semiconductor:

1. Lithography dust prevention scheme (photolithography mask dust cover component)
Mr. Ye 13680742014;
2. Dust free connection transmission solution (vacuum dust-free cable)
Mr. Li 13927334629;
3. Perfluorinated Microfiltration Scheme (Perfluorinated Filter)
Mr. Cao 13923623980.

About VOIR Semiconductor (Hangzhou) Co., Ltd ®SCU
      Based on fluoropolymer materials and cable component transmission solutions, we assist chip manufacturing/packaging/testing equipment manufacturers in providing reliable signal transmission, and provide ePTFE filter membranes, filter components, and fluorine sealing protection solutions for photolithography and filtration. We have provided solution products for multiple semiconductor manufacturers, including Asia's leading semiconductor manufacturers and the world's leading testing equipment manufacturers.