Microphone
During the high-volume assembly of printed circuit boards used in mobile phones, cameras, and other acoustic devices, several technical challenges may compromise the integrity of MEMS microphones.
These issues include pressure buildup caused by extremely high temperatures during the reflow process, particulate contamination, and molten solder spatter, all of which can damage MEMS microphones.
This leads to degraded acoustic performance of electronic devices, a significant reduction in yield, and increased manufacturing costs.
Voir has launched the Voir® thin-film material product protection solution for semiconductor packaging processes, which can help equipment withstand the extreme conditions encountered during assembly and significantly increase throughput.
We help manufacturers implement automated film‑removal solutions, which have already been deployed in optical component manufacturing and MEMS packaging.
Manufacturing Base: No. 8, Hexin Road, Ma’an Town, Huicheng District, Huizhou City, Guangdong Province
R&D Centers: Shenzhen | Hangzhou | Wuhan
Phone:+86 0752-5310684
Mobile phone:+86 18575268892
Email:s7@voir-tech.com.cn