Voir Technology has launched Voir®TIM™, a new type of thermal insulation film—suitable for 5G antennas and an innovative thermal insulation material that outperforms air.

Release time：2021-01-28

Voir Technology has professionally customized and launched the Voir®TIM™ new thermal insulation film based on 5G antennas, a pioneering material in China that boasts cutting-edge, innovative, and independently patented technology. It can reduce hotspots in 5G antennas, helping to address the thermal challenges and signal interference issues caused by the integrated power amplifiers in 5G antenna modules.

Voir®TIM™ new thermal insulation film is a novel thermal insulation material independently developed and innovated by Voir Technology, based on the fusion technology of silicon materials and ePTFE materials. It boasts excellent thermal insulation performance and electrical insulation properties, making it highly valuable for thermal management systems in high-power, ultra-thin 5G antennas and other mobile electronic devices.

Voir®TIM™ new thermal insulation film for 5G antennas

Today’s advanced 5G millimeter-wave (mmWave) antennas integrate power amplifiers, leading to increased overall heat generation. This not only poses safety risks but also degrades 5G performance. To reduce surface temperatures, the air gaps that can be added at the device edges are extremely limited, while lowering the operating frequency to mitigate thermal issues would compromise performance. Conductive thermal‑insulating materials, meanwhile, introduce signal interference and attenuation.

Voir®TIM™’s new thermal‑insulating film delivers superior thermal performance compared to air, with a thermal conductivity of just 0.020 W/m·K at 25°C—23% lower than that of air (0.026 W/m·K). It maintains stable thermal conductivity across temperature variations and exhibits extremely low signal loss (<0.3 dB). Applied by lamination along the edges of 5G antennas, it creates a robust physical barrier between the antenna and the device’s housing, preventing signal degradation caused by accidental contact between the 5G antenna and the enclosure. Additionally, it helps mitigate surface hotspots and reduce surface temperatures while preserving 5G signal strength and longevity, thereby enhancing the user experience.

When a 1W 5G mmWave antenna module was equipped with a 300-μm-thick Voir® TIM™ thermal interface material in a 500-μm air gap and operated for 20 minutes under identical conditions, the surface temperature was reduced by 4°C compared to an air‑filled gap.

Voir®TIM™ New Thermal Insulation Film for Mobile Devices

Mobile devices are becoming increasingly intelligent and slim, with their onboard SoC chips and high‑heat‑generating components tightly integrated, leaving only minimal internal air gaps. As a result, mobile devices face significant thermal‑management challenges.

Voir®TIM™’s innovative thermal‑insulating film can be easily applied to the back of SoC chips and other high‑heat‑generating components. With a thermal conductivity far lower than that of air, it effectively blocks and slows the transfer of heat from the source to the phone’s casing, thereby reducing surface temperatures. At the same time, it helps delay throttling and enhances overall device performance.

A senior materials engineer at Voir Technology’s Shenzhen R&D Center stated: “Voir®TIM™, a new thermal insulation film, is an independently developed, proprietary patented material by Voir. It can be easily integrated and used in conjunction with other thermal management solutions to optimize performance, making it an ideal new thermal insulation material for 5G antennas and mobile devices.”

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