New Voir®TIM™ insulating film for mobile devices
Mobile devices are becoming increasingly intelligent and slim, with their onboard SoC chips and high‑heat‑generating components tightly integrated and minimal internal air gaps, posing significant thermal management challenges.
Voir®TIM™’s innovative thermal‑insulating film can be easily applied to the back of SoC chips and other high‑heat‑generating components. With a thermal conductivity far lower than that of air, it effectively blocks and slows the transfer of heat from the source to the phone’s casing, thereby reducing surface temperatures. At the same time, it helps delay throttling and enhances overall device performance.
Manufacturing Base: No. 8, Hexin Road, Ma’an Town, Huicheng District, Huizhou City, Guangdong Province
R&D Centers: Shenzhen | Hangzhou | Wuhan
Phone:+86 0752-5310684
Mobile phone:+86 18575268892
Email:s7@voir-tech.com.cn