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Voir ® TIM ™ Application of New Thermal Insulation Membrane for Flat Panel Pen

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[Abstract]:

       Applying Voir ® TIM ™ The tablet computer with a new insulation film material solution is exported to the largest education group in South Korea, solving the pain points of learning and using tablets in the education field for a long time. Help terminal manufacturers continuously iterate and upgrade their products to meet consumers' higher experience demands.


       Long term use by students, overloaded tablet operation, hot surface shell, and poor experience.  The tablet runs 3D games and the surface shell temperature continues to rise.  Hot weather intensifies the temperature rise on the surface of tablet casing. 


I      EC60065:2014 requires that the surface temperature of electronic devices in contact with the human body be controlled at<42 ℃. Most tablet laptops on the market adopt the highly integrated and powerful R "X" scheme, which generates a large amount of heat and has a very small internal air gap (0.3mm).  Although the excellent thermal conductivity of graphite sheets and other thermal conductive materials has been utilized for thermal diffusion, the hot spots have been reduced and the surface temperature has been controlled to some extent. However, according to on-site testing results, there are still significant differences in distance from the surface temperature target value, some even reaching 8-10 ℃.


       Based on user safety and experience considerations, tablet and laptop manufacturers have conducted extensive experiments and come up with better thermal management solutions. Apply a 0.15 ± 0.02mm (0.15mm air gap) Voir on the inner side of the tablet pen housing above the graphite chip surface of the tablet pen CPU chip ® TIM ™ A new type of insulation film, with a thermal conductivity much lower than that of air, isolates and slows down heat transfer and lowers surface temperature by 4 ℃. Further eliminate hotspots, delay frequency reduction time, and improve user experience.

 

Voir ® TIM ™ Characteristics of New Thermal Insulation Membrane

1. Excellent insulation performance, thermal conductivity 0.020W/ mK@25 ° C, 0.026 W below air/ mK@25 ° C
Compared to air, the thermal conductivity changes less when the temperature changes
3. Voir ® TIM ™ New type of insulation film can reduce the surface temperature of flat panel laptops and reduce hot spots
4. In the later stage of design, Voir can also be easily integrated and used Voir® TIM ™
5. Customizable size, Voir  provides die-cutting or guides OEM die-cutting applications

 

 

Voir ® TIM ™ New type of insulation film parameters

       Senior Materials Engineer at the Shenzhen R&D Center of Voir said, "Voir ® TIM ™ new type of insulation film is a proprietary patented material independently developed by Voir,  which can be easily integrated and used in conjunction with graphite solutions to achieve performance optimization. It is an ideal insulation material for 5G antennas, mobile devices (tablet laptops/smartphones), and electronic devices in contact with the human body, providing protection solutions for application manufacturers. 

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