VOIR®SCU Iterative Semiconductor Vacuum‑Clean Connection Solution — Self‑Supporting / Long Stroke / Lower Outgassing

Release time：2024-08-30

Hangzhou VOIR®SCU’s iterative vacuum‑free‑dust connection solution. The key feature of the new solution is that it meets the highest‑level requirements for semiconductor lithography illumination systems:
1. Self-supporting;
2. Reduces component count and installation complexity over long strokes;
3. New process ensures lower outgassing during manufacturing and packaging: 10 ¹¹ Pa·L·s⁻¹·cm⁻².

VOIR® Semiconductor Materials Engineer: “With this iterative upgrade, we now meet the highest performance standards for today’s lithography illumination systems, significantly advancing the domestic semiconductor industry. We are confident that, by aligning with market trends, we can drive further technological progress.”
We will be showcasing our self-supporting vacuum‑free dust‑control technology at SEMICON Taiwan 2024. You are welcome to stop by for consultations and discussions.

VOIR®SCU in semiconductors:

1. Photolithography Dust-Proof Solution (Photomask Dust-Proof Cover Assembly)
Mr. Ye, 13680742014;
2. Dust-free connection and transmission solution (vacuum‑sealed dust‑free cable)
Mr. Li, 13927334629;
3. Perfluorinated Microfiltration Scheme (Perfluorinated Filter)
Mr. Cao, 13923623980.

About Voir Semiconductor (Hangzhou) Co., Ltd. VOIR®SCU
Based on fluoropolymer materials and cable‑assembly transmission solutions, we help chip manufacturing, packaging, and test‑and‑probe equipment manufacturers deliver reliable signal transmission. We also supply ePTFE filter membranes, filter cartridges, and fluoropolymer sealing and protection solutions for lithography and filtration applications. We have provided tailored solutions to numerous semiconductor companies, including leading Asian semiconductor firms and globally renowned test‑equipment manufacturers.

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