Voir®

Solution

Voir®MEMS protective breathable membrane

        During the large-scale assembly of printed circuit boards suitable for mobile phones, cameras, and other acoustic

devices, there are some technical issues that may endanger the integrity of MEMS microphones. These issues include

pressure accumulation, particle contamination, and atomized solder droplets caused by extremely high temperatures

during the reflow process, which may damage MEMS microphones, leading to a decrease in acoustic performance of

electronic devices, a significant reduction in production, and an increase in manufacturing costs.

        Voir  launches semiconductor packaging processes  film material product protection solutions can help equipment

resist extreme conditions during the assembly process, significantly increase production, and assist manufacturers in

providing installation and film removal automation solutions. They have been applied in optical component manufacturing

processes and MEMS packaging.

Protective products

Product Features

1. The pressure sensitive adhesive is firmly bonded, and the sealing of the microphone air outlet is reliable
2. Acoustic performance:<2 dB change 11.5 kHz,<3 dB change 5 kHz
3. Protection level: IP67 (1 meter water depth for 30 minutes)/IP68 (1 meter water depth for 1 hour)
4. Verified for durability of Double 85
5. IATF certified manufacturing

Installation recommendations

Application advantages

1. Established long-term cooperation with numerous well-known manufacturers both domestically and internationally, with mature solutions and extensive applications; 
2. The core materials are independently developed by Shengan; 
3. Provide scientific and systematic testing data; 
4. Customizable protection plans and products can be customized according to customer requirements; 
5. The on-site engineering personnel covering the whole country can quickly appear at the customer's site; 
6. Roll type packaging, seamless matching with high-speed SMT SMT SMT mounting machine production line; 
7. Provide wafer like format absorption packaging process solutions.